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HSC 340

Heatsink compound

Datasheet View Catalog

Specifications

Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.
- A grease-like silicon material, thickened with heat conductive metal oxides
- High thermal conductivity with low bleed
- No drying, hardening or melting
- Stable at high temperatures
- Suitable for the base and mounting studs of transistors, diodes and effective many heat sink devices
ColourWhite
Bleed after 24 hr at 200°C (392°F)0.05%
Evaporation after 24 hr at 200°C (392°F)0.5%
Drop point300°C (570°F)
Thermal conductivity, K factor0.0014 cal/sec-cm-°C
Dielectric strength210 volts/mil
Tubes of 100gr

Customisation possibilities

You can remark the customisation in your quote

Productcode HSC 340

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